- Interconnects Connectors Memory card connectors
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K108C-TAAO
MS Duo Socket
Description
SPECIFICATION MATERIAL
◆ Insulator: PA9T, rated UL94-0
◆ Contacts: Phosphor Bronze
◆ Shell: Stainless Steel
CONTACT PLATING
◆ Underplate: 50μ" Nickel
◆ Contact Area: 1μ" ~ 30μ" Selective Gold
◆ Solder Tails Area: 100μ" Tin/Lead
ELECTRICAL
◆ Operation Voltage: 3.3V
◆ Current Rating: 0.5A 125V,AC
◆ Contact resistance: 40 mohms initial(500μ" after endurance test)
◆ Insulation resistance: 1000 Mohms min. @ 500 VDC
◆ Dielectric Withstanding Voltage: 250 VAC / minute
◆ Operating temperature: -20°C to +60°C
◆ Mating cycles: 12,000 insertions(office environment)
◆ Insulator: PA9T, rated UL94-0
◆ Contacts: Phosphor Bronze
◆ Shell: Stainless Steel
CONTACT PLATING
◆ Underplate: 50μ" Nickel
◆ Contact Area: 1μ" ~ 30μ" Selective Gold
◆ Solder Tails Area: 100μ" Tin/Lead
ELECTRICAL
◆ Operation Voltage: 3.3V
◆ Current Rating: 0.5A 125V,AC
◆ Contact resistance: 40 mohms initial(500μ" after endurance test)
◆ Insulation resistance: 1000 Mohms min. @ 500 VDC
◆ Dielectric Withstanding Voltage: 250 VAC / minute
◆ Operating temperature: -20°C to +60°C
◆ Mating cycles: 12,000 insertions(office environment)
Supplier Information
Kendu Technology Co., Ltd.
TEL : 886-2-2695-0505 FAX : 886-2-2692-65659F, No.236, Jung Hsing Rd., Hsi-chih Dist., New Taipei City, post code 22158, Taiwan
Web-Site : http://www.kendu.com.tw/
E-Mail : melody@kendu.com.tw